l Semiconductor Materials
ü Laser Release Layer
ü Temporary Bonding Adhesive
ü Photosensitive Dielectric/Passivation
ü Protection Layer
ü Thermal Interface Material
ü High Purity Solvent
l LCD Materials
ü Black Matrix Resist
ü Photo Spacer
ü PI Alignment Layer
ü Liquid Crystal
ü Thermal Overcoat
ü Cu/Mo Etchant
ü Photoresist Stripper
l Touch Panel Materials
ü Photo Overcoat
ü Optical Clear Resin
l MicroLED Materials
ü Bank
ü Transfer Bonding Adhesive
ü Photosensitive Dielectric/Passivation